EDINS

PCB trouble?

EDINS solved this

When you meet EDINS, all your PCB purchase worries are solved.

HDI PCB

Layer : ~32L  Aspect ratio 11:1
Bind, Buried, Stack and HPL(Hole Plugging Land)
Production lead time 3~15 days
Wide material selection ranges FR-4 High Tg, Rogers, ISOLA, Panasonic(Halogen free) and Taconic

Board thickness 0.1mm ~ 3.2mm
Min Track / Gap/ Inner layer 40um / 40um(Special) / 60um / 80um(STD)
Outer layer 75um / 75um(Special) / 100um / 100um(STD)
Min hole diameter 0.15ø / 0.1ø (Mechanical / Laser) 0.1ø (stack via)
Micro via / Pad size  0.1ø / 270um

Rigid-Flex PCB

Design consulting
Blind / Buried via
SMD Assembly Possible!
Stack via  Layers up to 16L

Cu Thickness(RA / ED) : 9㎛ ~ 70㎛
Dimension : 500mm X 700mm
Impedance control : 50Ω ± 7%
Min. Track & Gap : 50㎛ / 50㎛
Edge to pattern clearance:100㎛

Special PCB

Layers up to 80     Blind / Buried via
Aspect ratio 26.6:1   Stack via   POV(Pad On Via)

Dimension(Diameter) :~650mm
Board thickness : 4.5mm ~ 8.0mm
Flatness : ± 200㎛
Thickness tolerance :150㎛
Impedance control : 50Ω ± 7%(5%, if Special) Surface Finish
ENEPIG : Electroless Ni + Electroless Pd + Imm. Ni / Au
Thick ENIG : Ni – 4~8㎛ / Au – 0.5~0.8㎛

Flexible PCB

COF & Flip chip scales
SMD Assembly Possible!
Layers up to 12L

Cu Thickness(RA / ED) : 9㎛ ~ 70㎛
Dimension : 500mm X 700mm / Roll-to-Roll
Min. Track & Gap : 25㎛ / 25㎛
Min. pattern to via clearance : 50㎛
Edge to pattern clearance:100㎛

MLB PCB

Layer :  ~ 50
Thickness :   6.2 mm
Material : FR-4(H) & etc
Size :  ~ 550 x 750 mm
Via on pad / BVH ( Blind & Buried )
MLB & Build-up