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  COF & Flip chip scales    
  SMD Assembly Possible!  
  Layers up to 12L  
  Cu Thickness(RA / ED) : 9㎛ ~ 70㎛
  Dimension : 500mm X 700mm / Roll-to-Roll
  Min. Track & Gap : 25㎛ / 25㎛
  Min. pattern to via clearance : 50㎛
  Edge to pattern clearance:100㎛
 
 
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