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  Layers up to 60    
  Blind / Buried via    
  Aspect ratio 26.6:1  
  Stack via  
  POV(Pad On Via)  
  Dimension(Diameter) :~650mm
  Board thickness : 4.5mm ~ 8.0mm
  Min Track & Gap    
    Inner layer : 40㎛ & 40㎛    
    Outer layer : 50㎛ & 50㎛
  Impedance control    
    50Ω ± 7%(5%, if Special)    
  Surface Finish : ENEPIG : Electroless Ni + Electroless Pd + Imm. Ni / Au
    Thick ENIG : Ni - 4~8㎛ / Au - 0.5~0.8㎛
 
 
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