www.edins.net
 
  Layers up to 80    
  Blind / Buried via    
  Aspect ratio 26.6:1  
  Stack via  
  POV(Pad On Via)  
  Dimension(Diameter) :~650mm
  Board thickness : 4.5mm ~ 8.0mm
  Flatness : ± 200㎛
  Thickness tolerance :150㎛
  Impedance control : 50Ω ± 7%(5%, if Special)
  Surface Finish
    -ENEPIG : Electroless Ni + Electroless Pd + Imm. Ni / Au
-Thick ENIG : Ni - 4~8㎛ / Au - 0.5~0.8㎛
 
 
Home I Sitemap l contact us
 
 
 
  copyright (c) 2009 edins . All rights Reserved .