www.edins.net
 
  Blind / Buried via    
  POV(Pad On Via)    
  Stack via    
  Layers up to 32L    
  7~10 Days Production    
  Min Track & Gap    
    -Inner layer:40㎛&40㎛(Special)    
    -Outer layer : 75㎛ & 75㎛(Special)    
  Min hole diameter    
    -Mechanical ~0.15mm    
    -Laser ~0.1mm
 (Stack via window as well)
   
  Via & Land diameter : 100㎛ & 270㎛
 
 
 
Home I Sitemap l contact us
 
 
 
  copyright (c) 2009 edins . All rights Reserved .